Introduction

In this project, you will perform a transient analysis of a Ball Grid Array (BGA) IC package. You will visualize the propagation of a short pulse by creating a transient plot of Y1 vs. Time, create a transient plot of the residual, obtain S-parameters over a broad frequency range, and view an overlay of the transient E-fields.

The geometry corresponds to a portion of a BGA-type chip package. The model has four signal lines as well as power and ground nets.

 

Network Analysis

You can perform a network analysis in both the frequency domain and the time domain (transient analysis). In addition to obtaining the familiar S-parameters, you can perform the analysis in the time domain to visualize the propagation of a short pulse through a device. You will do so in this exercise.

 

Sample Project: BGA IC Package

The model is installed with the Ansys Electronics Desktop application, and it is located in a subfolder within the Help branch of the installation path.

The geometry is complete – no additions or modifications are needed. However, you will apply the excitations, set up and run the analysis, and generate the reports and field overlay.

3D View of the BG IC Package used in the Getting Started Guide

Figure 1-1: BGA IC Package Geometry